Products Guide
Product
Status
Status
Category
F.S. Metal
B.S. Metal
Wafer Size
(inch)
(inch)
Die Size
(mil)
(mil)
Chip Thickness
(μm)
(μm)
PD
(W)
(W)
Vz
(%)
(%)
VB
Nom.
Nom.
V
VB
Min.
Min.
V
VB
Max.
Max.
V
ZZT
Max.
Max.
Ω
@ IZT
mA
ZZK
Max.
Max.
Ω
@ IZK
mA
IR1
Max.
Max.
μA
VRWM1
V
IR2
Max.
Max.
μA
VRWM2
V
Active
Power
Ag
Ag
6
35
250
0.8
2
5.1
4.998
5.202
6
100
550
1
4
1
270
3.06
Active
Power
Ag
Ag
6
35
250
0.8
2
5.6
5.488
5.712
3.9
100
580
1
0.5
2
90
3.4
Active
Power
Ag
Ag
6
35
250
0.8
2
6
5.88
6.12
2.92
100
580
1
0.5
2
45
3.6
Active
Power
Ag
Ag
6
35
250
0.8
2
6.2
6.076
6.324
2.92
100
680
1
0.1
2
4
3.7
Active
Power
Ag
Ag
6
35
250
0.8
2
6.8
6.664
6.936
2.92
100
680
1
0.1
3
0.8
4.1
Active
Power
Ag
Ag
6
35
250
0.8
2
7.5
7.35
7.65
1.94
100
680
0.5
0.1
3
1
6
Active
Power
Ag
Ag
6
35
250
0.8
2
8.2
8.036
8.364
1.94
100
680
0.5
0.1
3
0.2
6.6
Active
Power
Ag
Ag
6
35
250
0.8
2
8.7
8.526
8.874
2.92
50
680
0.5
0.1
4
0.2
7
Active
Power
Ag
Ag
6
35
250
0.8
2
9.1
8.918
9.282
3.9
50
680
0.5
0.1
5
0.2
7.3
Active
Power
Ag
Ag
6
35
250
0.8
2
10
9.8
10.2
3.9
50
680
0.25
0.1
7.5
0.2
9
- 1
*Remark of Product Status :
New Product
Active
NSND (Not Suggested for New Design)
EoL (End of Life)